Inventor

HAYASHIDA AKIHISA

JP2 patents

Patents

2 patents

US5286329AFeb 15, 1994

Tape-on-wafer mounting apparatus and method

FUJITSU LTD36 citations88

US5930654AJul 27, 1999

Method of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tape

FUJITSU LTD19 citations83