Inventor
LEET DAVID M
US3 patents
Patents
3 patentsUS6365502B1Apr 2, 2002
Microelectronic interconnect material with adhesion promotion layer and fabrication method
CVC PRODUCTS INC153 citations97
US6645847B2Nov 11, 2003
Microelectronic interconnect material with adhesion promotion layer and fabrication method
CVC PRODUCTS INC47 citations95
US6627995B2Sep 30, 2003
Microelectronic interconnect material with adhesion promotion layer and fabrication method
CVC PRODUCTS INC59 citations95