P

Inventor

MASHINO NAOHIRO

JP27 patents
⚠️ This page may combine multiple inventors who share the name “MASHINO NAOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKO ELECTRIC IND CO

24 patents
US6703310B2Mar 9, 2004

Semiconductor device and method of production of same

SHINKO ELECTRIC IND CO211 citations99
US7217888B2May 15, 2007

Electronic parts packaging structure and method of manufacturing the same

SHINKO ELECTRIC IND CO79 citations98
US6699787B2Mar 2, 2004

Semiconductor device and method of production of same

SHINKO ELECTRIC IND CO119 citations98
US6943442B2Sep 13, 2005

Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film

SHINKO ELECTRIC IND CO45 citations96
US6670269B2Dec 30, 2003

Method of forming through-hole or recess in silicon substrate

SHINKO ELECTRIC IND CO55 citations96
US6548891B2Apr 15, 2003

Semiconductor device and production process thereof

SHINKO ELECTRIC IND CO55 citations96
US6545353B2Apr 8, 2003

Multilayer wiring board and semiconductor device

SHINKO ELECTRIC IND CO59 citations96
US6507497B2Jan 14, 2003

Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer

SHINKO ELECTRIC IND CO61 citations96
US7936568B2May 3, 2011

Capacitor built-in substrate and method of manufacturing the same and electronic component device

SHINKO ELECTRIC IND CO24 citations92
US7114251B2Oct 3, 2006

Method of producing of circuit board; for semiconductor device

SHINKO ELECTRIC IND CO27 citations92
US6815348B2Nov 9, 2004

Method of plugging through-holes in silicon substrate

SHINKO ELECTRIC IND CO30 citations92
US7909976B2Mar 22, 2011

Method for filling through hole

SHINKO ELECTRIC IND CO9 citations84
US7755910B2Jul 13, 2010

Capacitor built-in interposer and method of manufacturing the same and electronic component device

SHINKO ELECTRIC IND CO13 citations84
US7655504B2Feb 2, 2010

Semiconductor device and method of manufacturing the same

SHINKO ELECTRIC IND CO15 citations84
US7205230B2Apr 17, 2007

Process for manufacturing a wiring board having a via

SHINKO ELECTRIC IND CO11 citations84
US6661077B2Dec 9, 2003

Semiconductor device including primary connecting plug and an auxiliary connecting plug

SHINKO ELECTRIC IND CO13 citations84
US6872634B2Mar 29, 2005

Method of manufacturing micro-semiconductor element

SHINKO ELECTRIC IND CO11 citations74
US8004382B2Aug 23, 2011

Inductor device, and method of manufacturing the same

SHINKO ELECTRIC IND CO4 citations63
US7929320B2Apr 19, 2011

Inductor built-in wiring board having shield function

SHINKO ELECTRIC IND CO4 citations63
US7530163B2May 12, 2009

Electronic parts packaging structure and method of manufacturing the same

SHINKO ELECTRIC IND CO4 citations63
US7084009B2Aug 1, 2006

Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate

SHINKO ELECTRIC IND CO4 citations63
US11659667B2May 23, 2023

Wiring board and method of manufacturing wiring board

SHINKO ELECTRIC IND CO0 citations62
US8007649B2Aug 30, 2011

Hydrophilic treatment method and wiring pattern forming method

SHINKO ELECTRIC IND CO1 citations52
US6433415B2Aug 13, 2002

Assembly of plurality of semiconductor devices

SHINKO ELECTRIC IND CO1 citations51

HITACHI LTD

1 patent

MASHINO NAOHIRO

1 patent

TAKANO AKIHITO

1 patent