Inventor
MASHINO NAOHIRO
JP27 patents
⚠️ This page may combine multiple inventors who share the name “MASHINO NAOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
24 patentsUS6703310B2Mar 9, 2004
Semiconductor device and method of production of same
SHINKO ELECTRIC IND CO211 citations99
US7217888B2May 15, 2007
Electronic parts packaging structure and method of manufacturing the same
SHINKO ELECTRIC IND CO79 citations98
US6699787B2Mar 2, 2004
Semiconductor device and method of production of same
SHINKO ELECTRIC IND CO119 citations98
US6943442B2Sep 13, 2005
Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film
SHINKO ELECTRIC IND CO45 citations96
US6670269B2Dec 30, 2003
Method of forming through-hole or recess in silicon substrate
SHINKO ELECTRIC IND CO55 citations96
US6548891B2Apr 15, 2003
Semiconductor device and production process thereof
SHINKO ELECTRIC IND CO55 citations96
US6545353B2Apr 8, 2003
Multilayer wiring board and semiconductor device
SHINKO ELECTRIC IND CO59 citations96
US6507497B2Jan 14, 2003
Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer
SHINKO ELECTRIC IND CO61 citations96
US7936568B2May 3, 2011
Capacitor built-in substrate and method of manufacturing the same and electronic component device
SHINKO ELECTRIC IND CO24 citations92
US7114251B2Oct 3, 2006
Method of producing of circuit board; for semiconductor device
SHINKO ELECTRIC IND CO27 citations92
US6815348B2Nov 9, 2004
Method of plugging through-holes in silicon substrate
SHINKO ELECTRIC IND CO30 citations92
US7909976B2Mar 22, 2011
Method for filling through hole
SHINKO ELECTRIC IND CO9 citations84
US7755910B2Jul 13, 2010
Capacitor built-in interposer and method of manufacturing the same and electronic component device
SHINKO ELECTRIC IND CO13 citations84
US7655504B2Feb 2, 2010
Semiconductor device and method of manufacturing the same
SHINKO ELECTRIC IND CO15 citations84
US7205230B2Apr 17, 2007
Process for manufacturing a wiring board having a via
SHINKO ELECTRIC IND CO11 citations84
US6661077B2Dec 9, 2003
Semiconductor device including primary connecting plug and an auxiliary connecting plug
SHINKO ELECTRIC IND CO13 citations84
US6872634B2Mar 29, 2005
Method of manufacturing micro-semiconductor element
SHINKO ELECTRIC IND CO11 citations74
US8004382B2Aug 23, 2011
Inductor device, and method of manufacturing the same
SHINKO ELECTRIC IND CO4 citations63
US7929320B2Apr 19, 2011
Inductor built-in wiring board having shield function
SHINKO ELECTRIC IND CO4 citations63
US7530163B2May 12, 2009
Electronic parts packaging structure and method of manufacturing the same
SHINKO ELECTRIC IND CO4 citations63
US7084009B2Aug 1, 2006
Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate
SHINKO ELECTRIC IND CO4 citations63
US11659667B2May 23, 2023
Wiring board and method of manufacturing wiring board
SHINKO ELECTRIC IND CO0 citations62
US8007649B2Aug 30, 2011
Hydrophilic treatment method and wiring pattern forming method
SHINKO ELECTRIC IND CO1 citations52
US6433415B2Aug 13, 2002
Assembly of plurality of semiconductor devices
SHINKO ELECTRIC IND CO1 citations51