Inventor
WONG WAH S
US17 patents
⚠️ This page may combine multiple inventors who share the name “WONG WAH S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HRL LAB LLC
7 patentsUS7514759B1Apr 7, 2009
Piezoelectric MEMS integration with GaN technology
HRL LAB LLC125 citations96
US7989277B1Aug 2, 2011
Integrated structure with transistors and Schottky diodes and process for fabricating the same
HRL LAB LLC18 citations91
US8368119B1Feb 5, 2013
Integrated structure with transistors and schottky diodes and process for fabricating the same
HRL LAB LLC8 citations82
US9640680B1May 2, 2017
Wide-band transparent electrical contacts and interconnects for FPAS and a method of making the same
HRL LAB LLC3 citations73
US6830945B2Dec 14, 2004
Method for fabricating a non-planar nitride-based heterostructure field effect transistor
HRL LAB LLC5 citations72
US9190534B1Nov 17, 2015
Enhancement mode normally-off gallium nitride heterostructure field effect transistor
HRL LAB LLC0 citations52
US7247893B2Jul 24, 2007
Non-planar nitride-based heterostructure field effect transistor
HRL LAB LLC1 citations50
HUGHES AIRCRAFT CO
5 patentsUS5708283AJan 13, 1998
Flip chip high power monolithic integrated circuit thermal bumps
HUGHES AIRCRAFT CO15 citations72
US5616517AApr 1, 1997
Flip chip high power monolithic integrated circuit thermal bumps and fabrication method
HUGHES AIRCRAFT CO14 citations72
US5514838AMay 7, 1996
Circuit structure with non-migrating silver contacts
HUGHES AIRCRAFT CO8 citations71
US4800420AJan 24, 1989
Two-terminal semiconductor diode arrangement
HUGHES AIRCRAFT CO15 citations71
US4855796AAug 8, 1989
Beam lead mixer diode
HUGHES AIRCRAFT CO16 citations69
RAYTHEON CO
4 patentsUS5773897AJun 30, 1998
Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps
RAYTHEON CO47 citations92
US5877560AMar 2, 1999
Flip chip microwave module and fabrication method
RAYTHEON CO26 citations90
US5998817ADec 7, 1999
High power prematched MMIC transistor with improved ground potential continuity
RAYTHEON CO9 citations71
US5861341AJan 19, 1999
Plated nickel-gold/dielectric interface for passivated MMICs
RAYTHEON CO6 citations57