Inventor
CONNER DENNIS LEE
US11 patents
⚠️ This page may combine multiple inventors who share the name “CONNER DENNIS LEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
9 patentsUS9484210B2Nov 1, 2016
Semiconductor die singulation method
SEMICONDUCTOR COMPONENTS IND LLC7 citations83
US9847219B2Dec 19, 2017
Semiconductor die singulation method
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11984388B2May 14, 2024
Semiconductor package structures and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US11710686B2Jul 25, 2023
Semiconductor package structures and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US11217515B2Jan 4, 2022
Semiconductor package structures and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US10522448B2Dec 31, 2019
Single or multi chip module package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US9911684B1Mar 6, 2018
Holes and dimples to control solder flow
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US9870986B2Jan 16, 2018
Single or multi chip module package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US9558968B2Jan 31, 2017
Single or multi chip module package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations51