Inventor

LO WEI-CHUNG

TW23 patents

⚠️ This page may combine multiple inventors who share the name “LO WEI-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LO WEI-CHUNG

IND TECH RES INST

Method for fabrication of wafer level package incorporating dual compliant layers

Wafer level package incorporating dual compliant layers and method for fabrication

Light-emitting device and manufacturing method of a display

Thinned integrated circuit device and manufacturing process for the same

Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels

Package substrate having photo-sensitive dielectric layer and method of fabricating the same

Hetero-integrated structure

Package substrate and method of fabricating the same

Package substrate and method of fabricating the same and chip package structure

Electromagnetic wave transmission board and differential electromagnetic wave transmission board

Wafer-to-wafer stack with supporting post

Package substrate and method of fabricating the same

Package structure and method for connecting components

Wafer-to-wafer stacking

Wafer level chip scale packaging structure and method of fabricating the same

Package substrate and method of fabricating the same

CHANG CHI-SHIH

Wafer-to-wafer stack with supporting pedestal

Wafer-to-wafer stack with supporting pedestal

KO CHENG-TA

Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

HSU CHAO-KAI

Plane light source and flexible plane light source

UNIV NAT CHIAO TUNG

Heterostructure containing IC and LED and method for fabricating the same

CHEN KUAN-NENG

Heterostructure containing IC and LED and method for fabricating the same

CHEN KUAN NENG

Bonding structure and method of fabricating the same