Inventor
HSIEH CHANG-HONG
TW4 patents
Patents
4 patentsUS9485874B2Nov 1, 2016
Package substrate having photo-sensitive dielectric layer and method of fabricating the same
IND TECH RES INST7 citations82
US10068847B2Sep 4, 2018
Package substrate and method of fabricating the same
IND TECH RES INST2 citations71
US11791256B2Oct 17, 2023
Package substrate and method of fabricating the same
IND TECH RES INST0 citations61
US10867907B2Dec 15, 2020
Package substrate and method of fabricating the same
IND TECH RES INST0 citations50