Inventor
WANG SOON WEI
MY36 patents
⚠️ This page may combine multiple inventors who share the name “WANG SOON WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
31 patentsUS10199311B2Feb 5, 2019
Leadless semiconductor packages, leadframes therefor, and methods of making
SEMICONDUCTOR COMPONENTS IND LLC9 citations84
US11404276B2Aug 2, 2022
Semiconductor packages with thin die and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US11342189B2May 24, 2022
Semiconductor packages with die including cavities and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US9748163B1Aug 29, 2017
Die support for enlarging die size
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11532539B2Dec 20, 2022
Semiconductor package with wettable flank
SEMICONDUCTOR COMPONENTS IND LLC1 citations71
US11721654B2Aug 8, 2023
Ultra-thin multichip power devices
SEMICONDUCTOR COMPONENTS IND LLC2 citations69
US10930604B2Feb 23, 2021
Ultra-thin multichip power devices
SEMICONDUCTOR COMPONENTS IND LLC2 citations69
US12444609B2Oct 14, 2025
Silicon-on-insulator die support structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12424522B2Sep 23, 2025
Leadless semiconductor packages, leadframes therefor, and methods of making
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12374555B2Jul 29, 2025
Die sidewall coatings and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12374554B2Jul 29, 2025
Semiconductor packages with die including cavities and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12040192B2Jul 16, 2024
Die sidewall coatings and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11908699B2Feb 20, 2024
Semiconductor packages with die including cavities
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11901184B2Feb 13, 2024
Backmetal removal methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11894234B2Feb 6, 2024
Semiconductor packages with die support structure for thin die
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11508679B2Nov 22, 2022
Polymer resin and compression mold chip scale package
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11404277B2Aug 2, 2022
Die sidewall coatings and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11361970B2Jun 14, 2022
Silicon-on-insulator die support structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11348796B2May 31, 2022
Backmetal removal methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12243810B2Mar 4, 2025
Semiconductor package with wettable flank and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12176272B2Dec 24, 2024
Semiconductor package with wettable flank
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US10916485B2Feb 9, 2021
Molded wafer level packaging
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US10971429B2Apr 6, 2021
Method for forming a semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US10825754B2Nov 3, 2020
Quad flat no leads package with locking feature
SEMICONDUCTOR COMPONENTS IND LLC1 citations55
US10825786B2Nov 3, 2020
Polymer resin and compression mold chip scale package
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
US10283466B2May 7, 2019
Polymer resin and compression mold chip scale package
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
US10607921B2Mar 31, 2020
Method for forming a semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations48
US10607920B2Mar 31, 2020
Semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations48
US10559510B2Feb 11, 2020
Molded wafer level packaging
SEMICONDUCTOR COMPONENTS IND LLC0 citations48
US10177074B1Jan 8, 2019
Flexible semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations48
US10438877B1Oct 8, 2019
Multi-chip packages with stabilized die pads
SEMICONDUCTOR COMPONENTS IND LLC0 citations42
SEMICONDUCTOR COMPONENTS IND
3 patentsUS10756006B2Aug 25, 2020
Leadless semiconductor packages, leadframes therefor, and methods of making
SEMICONDUCTOR COMPONENTS IND1 citations73
US9281258B1Mar 8, 2016
Chip scale packages and related methods
SEMICONDUCTOR COMPONENTS IND6 citations69
US7939380B2May 10, 2011
Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure
SEMICONDUCTOR COMPONENTS IND3 citations62