Inventor
HA YONG-DAE
KR6 patents
Patents
6 patentsUS10692833B2Jun 23, 2020
Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same
SAMSUNG ELECTRONICS CO LTD8 citations79
US8042593B2Oct 25, 2011
Semiconductor chip bonding apparatus
SAMSUNG ELECTRONICS CO LTD9 citations73
US10330722B2Jun 25, 2019
Pipe structure and semiconductor module testing equipment including the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US9324661B2Apr 26, 2016
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations69
US11482505B2Oct 25, 2022
Chip bonding apparatus
SAMSUNG ELECTRONICS CO LTD1 citations57
US6187121B1Feb 13, 2001
Die-bonding equipment and a method for detecting residual adhesive material using the same
SAMSUNG ELECTRONICS CO LTD5 citations57