Inventor
FUKUCHI RYO
JP13 patents
⚠️ This page may combine multiple inventors who share the name “FUKUCHI RYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JX NIPPON MINING & METALS CORP
10 patentsUS9724896B2Aug 8, 2017
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
JX NIPPON MINING & METALS CORP8 citations81
US10925171B2Feb 16, 2021
Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device
JX NIPPON MINING & METALS CORP3 citations70
US10464291B2Nov 5, 2019
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
JX NIPPON MINING & METALS CORP1 citations60
US8357307B2Jan 22, 2013
Method of forming electronic circuit
JX NIPPON MINING & METALS CORP2 citations60
US10820414B2Oct 27, 2020
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JX NIPPON MINING & METALS CORP0 citations51
US10383222B2Aug 13, 2019
Surface-treated copper foil
JX NIPPON MINING & METALS CORP0 citations51
US10070521B2Sep 4, 2018
Surface-treated copper foil
JX NIPPON MINING & METALS CORP1 citations50
US10925170B2Feb 16, 2021
Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JX NIPPON MINING & METALS CORP0 citations49
US10791631B2Sep 29, 2020
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JX NIPPON MINING & METALS CORP0 citations49
US10448507B2Oct 15, 2019
Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
JX NIPPON MINING & METALS CORP0 citations39
YAMANISHI KEISUKE
2 patentsUS8668994B2Mar 11, 2014
Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same
YAMANISHI KEISUKE0 citations44
US8580390B2Nov 12, 2013
Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same
YAMANISHI KEISUKE0 citations44