Inventor
GOGINENI SIREESHA
US7 patents
Patents
7 patentsUS9871007B2Jan 16, 2018
Packaged integrated circuit device with cantilever structure
INTEL CORP20 citations92
US12046581B2Jul 23, 2024
Integrated circuit package with glass spacer
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US11848292B2Dec 19, 2023
Pad design for thermal fatigue resistance and interconnect joint reliability
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US11694976B2Jul 4, 2023
Bowl shaped pad
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US11393788B2Jul 19, 2022
Integrated circuit package with glass spacer
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US10490516B2Nov 26, 2019
Packaged integrated circuit device with cantilever structure
INTEL CORP0 citations50
US11881441B2Jan 23, 2024
Stacked die semiconductor package spacer die
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