Inventor
STOEK THOMAS
DE17 patents
Patents
17 patentsUS9978672B1May 22, 2018
Transistor package with terminals coupled via chip carrier
INFINEON TECHNOLOGIES AG9 citations79
US11101201B2Aug 24, 2021
Semiconductor package having leads with a negative standoff
INFINEON TECHNOLOGIES AG2 citations72
US10147703B2Dec 4, 2018
Semiconductor package for multiphase circuitry device
INFINEON TECHNOLOGIES AG3 citations68
US10651109B2May 12, 2020
Selective plating of semiconductor package leads
INFINEON TECHNOLOGIES AG2 citations65
US11621204B2Apr 4, 2023
Molded semiconductor module having a mold step for increasing creepage distance
INFINEON TECHNOLOGIES AG3 citations64
US11901257B2Feb 13, 2024
Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package
INFINEON TECHNOLOGIES AG0 citations62
US11862541B2Jan 2, 2024
Molded semiconductor package having a negative standoff
INFINEON TECHNOLOGIES AG0 citations61
US11302613B2Apr 12, 2022
Double-sided cooled molded semiconductor package
INFINEON TECHNOLOGIES AG0 citations60
US10886199B1Jan 5, 2021
Molded semiconductor package with double-sided cooling
INFINEON TECHNOLOGIES AG1 citations60
US11769748B2Sep 26, 2023
Semiconductor device having a metal clip with a solder volume balancing reservoir
INFINEON TECHNOLOGIES AG0 citations59
US11545459B2Jan 3, 2023
Metal clip with solder volume balancing reservoir
INFINEON TECHNOLOGIES AG0 citations59
US10971436B2Apr 6, 2021
Multi-branch terminal for integrated circuit (IC) package
INFINEON TECHNOLOGIES AG0 citations59
US10319671B2Jun 11, 2019
Semiconductor package with leadframe
INFINEON TECHNOLOGIES AG1 citations57
US11699640B2Jul 11, 2023
Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production
INFINEON TECHNOLOGIES AG0 citations50
US11183445B2Nov 23, 2021
Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement
INFINEON TECHNOLOGIES AG0 citations49
US10354943B1Jul 16, 2019
Multi-branch terminal for integrated circuit (IC) package
INFINEON TECHNOLOGIES AG0 citations48
US12046540B2Jul 23, 2024
Leadframe package with adjustable clip
INFINEON TECHNOLOGIES AG0 citations42