Inventor
MACHEINER STEFAN
DE14 patents
⚠️ This page may combine multiple inventors who share the name “MACHEINER STEFAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
12 patentsUS11101201B2Aug 24, 2021
Semiconductor package having leads with a negative standoff
INFINEON TECHNOLOGIES AG2 citations72
US9385059B2Jul 5, 2016
Overmolded substrate-chip arrangement with heat sink
INFINEON TECHNOLOGIES AG3 citations72
US11133281B2Sep 28, 2021
Chip to chip interconnect in encapsulant of molded semiconductor package
INFINEON TECHNOLOGIES AG2 citations71
US10147703B2Dec 4, 2018
Semiconductor package for multiphase circuitry device
INFINEON TECHNOLOGIES AG3 citations68
US11862541B2Jan 2, 2024
Molded semiconductor package having a negative standoff
INFINEON TECHNOLOGIES AG0 citations61
US11569196B2Jan 31, 2023
Chip to chip interconnect in encapsulant of molded semiconductor package
INFINEON TECHNOLOGIES AG0 citations61
US11469161B2Oct 11, 2022
Lead frame-based semiconductor package
INFINEON TECHNOLOGIES AG1 citations61
US11342252B2May 24, 2022
Leadframe leads having fully plated end faces
INFINEON TECHNOLOGIES AG0 citations61
US10796986B2Oct 6, 2020
Leadframe leads having fully plated end faces
INFINEON TECHNOLOGIES AG0 citations51
US11145578B2Oct 12, 2021
Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package
INFINEON TECHNOLOGIES AG0 citations50
US10121753B2Nov 6, 2018
Enhanced solder pad
INFINEON TECHNOLOGIES AG0 citations48
US10770399B2Sep 8, 2020
Semiconductor package having a filled conductive cavity
INFINEON TECHNOLOGIES AG0 citations32