Inventor
AHN JEONG HOON
KR42 patents
⚠️ This page may combine multiple inventors who share the name “AHN JEONG HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
38 patentsUS6953745B2Oct 11, 2005
Void-free metal interconnection structure and method of forming the same
SAMSUNG ELECTRONICS CO LTD17 citations84
US11043456B2Jun 22, 2021
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD8 citations82
US7154162B2Dec 26, 2006
Integrated circuit capacitor structure
SAMSUNG ELECTRONICS CO LTD16 citations79
US11538747B2Dec 27, 2022
Interposer structure, semiconductor package comprising the same, and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US10892318B2Jan 12, 2021
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US11133266B2Sep 28, 2021
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10867908B2Dec 15, 2020
Semiconductor device having buffer structure surrounding through via
SAMSUNG ELECTRONICS CO LTD3 citations72
US11114524B2Sep 7, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations71
US9831139B2Nov 28, 2017
Test structure and method of manufacturing structure including the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10396030B2Aug 27, 2019
Semiconductor device, layout design method for the same and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations69
US8013455B2Sep 6, 2011
Semiconductor device having pads
SAMSUNG ELECTRONICS CO LTD4 citations63
US12328882B2Jun 10, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12279408B2Apr 15, 2025
Semiconductor device and stack of semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations62
US12199016B2Jan 14, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11961882B2Apr 16, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11876038B2Jan 16, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11871553B2Jan 9, 2024
Semiconductor device and stack of semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations62
US11728311B2Aug 15, 2023
Semiconductor devices including interposer substrates further including capacitors
SAMSUNG ELECTRONICS CO LTD1 citations62
US7560332B2Jul 14, 2009
Integrated circuit capacitor structure
SAMSUNG ELECTRONICS CO LTD4 citations62
US7351653B2Apr 1, 2008
Method for damascene process
SAMSUNG ELECTRONICS CO LTD2 citations62
US11791267B2Oct 17, 2023
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations61
US11469174B2Oct 11, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US11257754B2Feb 22, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US12142587B2Nov 12, 2024
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11804459B2Oct 31, 2023
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11437374B2Sep 6, 2022
Semiconductor device and stacked semiconductor chips including through contacts
SAMSUNG ELECTRONICS CO LTD0 citations57
US7358155B2Apr 15, 2008
Scribe-line structures and methods of forming the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US7229875B2Jun 12, 2007
Integrated circuit capacitor structure
SAMSUNG ELECTRONICS CO LTD1 citations52
US12014935B2Jun 18, 2024
Interposer and method of manufacturing the interposer
SAMSUNG ELECTRONICS CO LTD0 citations51
US11798883B2Oct 24, 2023
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US7417302B2Aug 26, 2008
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US12354980B2Jul 8, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12300649B2May 13, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12598978B2Apr 7, 2026
Semiconductor device having a source/drain contact connected to a back-side power rail by a landing pad and a through electrode
SAMSUNG ELECTRONICS CO LTD0 citations47
US12599040B2Apr 7, 2026
Three-dimensional integrated circuit structure and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations44
US10062640B2Aug 28, 2018
Semiconductor devices including sealing regions and decoupling capacitor regions
SAMSUNG ELECTRONICS CO LTD0 citations40
US10424513B2Sep 24, 2019
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations39
US9716043B2Jul 25, 2017
Wiring structure and method of forming the same, and semiconductor device including the wiring structure
SAMSUNG ELECTRONICS CO LTD0 citations37