Inventor
HUANG YI-CHEN
TW21 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YI-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
12 patentsUS6458650B1Oct 1, 2002
CU second electrode process with in situ ashing and oxidation process
TAIWAN SEMICONDUCTOR MFG34 citations92
US8048733B2Nov 1, 2011
Method for fabricating a gate structure
TAIWAN SEMICONDUCTOR MFG29 citations90
US7122484B2Oct 17, 2006
Process for removing organic materials during formation of a metal interconnect
TAIWAN SEMICONDUCTOR MFG19 citations90
US7022610B2Apr 4, 2006
Wet cleaning method to eliminate copper corrosion
TAIWAN SEMICONDUCTOR MFG14 citations84
US7247939B2Jul 24, 2007
Metal filled semiconductor features with improved structural stability
TAIWAN SEMICONDUCTOR MFG18 citations83
US8361855B2Jan 29, 2013
Method for fabricating a gate structure
TAIWAN SEMICONDUCTOR MFG15 citations82
US7217663B2May 15, 2007
Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof
TAIWAN SEMICONDUCTOR MFG7 citations73
US6497785B2Dec 24, 2002
Wet chemical process tank with improved fluid circulation
TAIWAN SEMICONDUCTOR MFG11 citations73
US7196002B2Mar 27, 2007
Method of making dual damascene with via etch through
TAIWAN SEMICONDUCTOR MFG5 citations63
US7834389B2Nov 16, 2010
Triangular space element for semiconductor device
TAIWAN SEMICONDUCTOR MFG4 citations61
US6884728B2Apr 26, 2005
Method for removing polymeric residue contamination on semiconductor feature sidewalls
TAIWAN SEMICONDUCTOR MFG4 citations59
US7436009B2Oct 14, 2008
Via structures and trench structures and dual damascene structures
TAIWAN SEMICONDUCTOR MFG0 citations51