Inventor
BABA MASAKAZU
JP16 patents
⚠️ This page may combine multiple inventors who share the name “BABA MASAKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
8 patentsUS6881315B2Apr 19, 2005
Fractionating apparatus having colonies of pillars arranged in migration passage at interval and process for fabricating pillars
NEC CORP80 citations97
US7586091B2Sep 8, 2009
Mass spectrometric system and mass spectrometry
NEC CORP19 citations92
US7842514B2Nov 30, 2010
Particle manipulation unit, chip and detection device having the same, mounted thereon, and methods of separating, capturing and detecting proteins
NEC CORP9 citations83
US6755953B2Jun 29, 2004
Method for forming ordered structure of fine metal particles
NEC CORP15 citations83
US6099945AAug 8, 2000
Atomic mask and method of patterning a substrate with the atomic mask
NEC CORP6 citations73
US7785533B2Aug 31, 2010
Chip, device using the chip, and method of using the same
NEC CORP6 citations71
US7274016B2Sep 25, 2007
Liquid switch, and microchip and mass-analyzing system using the same
NEC CORP3 citations61
US6331238B1Dec 18, 2001
Method of patterning a substrate with an atomic mask
NEC CORP0 citations51
FUJI ELECTRIC CO LTD
5 patentsUS12261217B2Mar 25, 2025
Semiconductor device
FUJI ELECTRIC CO LTD0 citations62
US11996475B2May 28, 2024
Semiconductor device
FUJI ELECTRIC CO LTD0 citations62
US12563820B2Feb 24, 2026
Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
FUJI ELECTRIC CO LTD0 citations52
US12426330B2Sep 23, 2025
Semiconductor device
FUJI ELECTRIC CO LTD0 citations51
US12119399B2Oct 15, 2024
Semiconductor device including vertical MOSFET and Schottky barrier diode
FUJI ELECTRIC CO LTD0 citations51
YONEDA SHUJI
2 patentsUS8153467B2Apr 10, 2012
Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same
YONEDA SHUJI3 citations57
US8525285B2Sep 3, 2013
Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture
YONEDA SHUJI0 citations47