Inventor
CHEN HAN-DE
TW15 patents
Patents
15 patentsUS11908708B2Feb 20, 2024
Laser de-bonding carriers and composite carriers thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11855040B2Dec 26, 2023
Ion implantation with annealing for substrate cutting
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12557612B2Feb 17, 2026
Bonding system with sealing gasket and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12347696B2Jul 1, 2025
Laser de-bonding carriers and composite carriers thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12327811B2Jun 10, 2025
Ion implantation with annealing for substrate cutting
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237211B2Feb 25, 2025
Bonding system with sealing gasket and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230532B2Feb 18, 2025
Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12249592B2Mar 11, 2025
Dynamic bonding gap control and tool for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12211820B2Jan 28, 2025
Wafer bonding apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12132079B2Oct 29, 2024
Bonding and isolation techniques for stacked transistor structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12368129B2Jul 22, 2025
Temperature controllable bonder equipment for substrate bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12255171B2Mar 18, 2025
Wafer bonding system and method of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11842933B2Dec 12, 2023
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11996317B2May 28, 2024
Methods for forming isolation regions by depositing and oxidizing a silicon liner
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12489082B2Dec 2, 2025
Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49