Inventor
KANDETZKE STEVEN M
US14 patents
Patents
14 patentsUS4885038ADec 5, 1989
Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
IBM72 citations95
US4599136AJul 8, 1986
Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials
IBM56 citations93
US5139851AAug 18, 1992
Low dielectric composite substrate
IBM22 citations92
US4749621AJun 7, 1988
Electronic components comprising polyimide-filled isolation structures
IBM33 citations92
US4654223AMar 31, 1987
Method for forming a film of dielectric material on an electric component
IBM26 citations92
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US4656050AApr 7, 1987
Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
IBM24 citations82
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US4568601AFeb 4, 1986
Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures
IBM19 citations81
US4871619AOct 3, 1989
Electronic components comprising polymide dielectric layers
IBM17 citations73
US4699803AOct 13, 1987
Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
IBM15 citations73
US5147741ASep 15, 1992
Phenyl-endcapped depolymerizable polymer
IBM12 citations72
US4987211AJan 22, 1991
Phenyl-endcapped depolymerizable polymer
IBM7 citations70
US4622383ANov 11, 1986
Method for the fractionation of reactive terminated polymerizable oligomers
IBM4 citations62