Inventor
TAKACS MARK A
US17 patents
Patents
17 patentsUS6336262B1Jan 8, 2002
Process of forming a capacitor with multi-level interconnection technology
IBM174 citations97
US5094769AMar 10, 1992
Compliant thermally conductive compound
IBM76 citations96
US4599136AJul 8, 1986
Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials
IBM56 citations93
US5213704AMay 25, 1993
Process for making a compliant thermally conductive compound
IBM26 citations92
US5139851AAug 18, 1992
Low dielectric composite substrate
IBM22 citations92
US4749621AJun 7, 1988
Electronic components comprising polyimide-filled isolation structures
IBM33 citations92
US4654223AMar 31, 1987
Method for forming a film of dielectric material on an electric component
IBM26 citations92
US5808853ASep 15, 1998
Capacitor with multi-level interconnection technology
IBM38 citations91
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US4665007AMay 12, 1987
Planarization process for organic filling of deep trenches
IBM51 citations87
US4656050AApr 7, 1987
Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
IBM24 citations82
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US4568601AFeb 4, 1986
Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures
IBM19 citations81
US4871619AOct 3, 1989
Electronic components comprising polymide dielectric layers
IBM17 citations73
US4699803AOct 13, 1987
Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
IBM15 citations73
US4622383ANov 11, 1986
Method for the fractionation of reactive terminated polymerizable oligomers
IBM4 citations62
US6555912B1Apr 29, 2003
Corrosion-resistant electrode structure for integrated circuit decoupling capacitors
IBM2 citations53