Inventor
DEANGELIS DOMINICK A
US19 patents
⚠️ This page may combine multiple inventors who share the name “DEANGELIS DOMINICK A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KULICKE & SOFFA IND INC
15 patentsUS7137543B2Nov 21, 2006
Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers
KULICKE & SOFFA IND INC19 citations92
US10381321B2Aug 13, 2019
Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
KULICKE & SOFFA IND INC5 citations83
US9362247B2Jun 7, 2016
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC4 citations82
US9136240B2Sep 15, 2015
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC4 citations82
US11462506B2Oct 4, 2022
Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
KULICKE & SOFFA IND INC1 citations72
US11011492B2May 18, 2021
Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
KULICKE & SOFFA IND INC2 citations72
US9780065B2Oct 3, 2017
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC3 citations72
US9633981B2Apr 25, 2017
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC2 citations71
US10987753B2Apr 27, 2021
Wedge bonding tools, wedge bonding systems, and related methods
KULICKE & SOFFA IND INC0 citations62
US9905530B2Feb 27, 2018
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC1 citations61
US10449627B2Oct 22, 2019
Wedge bonding tools, wedge bonding systems, and related methods
KULICKE & SOFFA IND INC0 citations51
US10297568B2May 21, 2019
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC0 citations51
US9779965B2Oct 3, 2017
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC0 citations51
US10312216B2Jun 4, 2019
Systems and methods for bonding semiconductor elements
KULICKE & SOFFA IND INC0 citations50
US8365977B2Feb 5, 2013
Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
KULICKE & SOFFA IND INC1 citations48