Inventor
HORIKOSHI EIJI
JP7 patents
Patents
7 patentsUS5972807AOct 26, 1999
Photosensitive, heat-resistant resin composition and process for using same to form patterns as well as polymeric composite and production process thereof
FUJITSU LTD31 citations92
US5308929AMay 3, 1994
Via hole structure and process for formation thereof
FUJITSU LTD26 citations91
US6045975AApr 4, 2000
Photosensitive, heat-resistant resin composition for forming patterns
FUJITSU LTD13 citations73
US6013419AJan 11, 2000
Process for using photosensitive, heat-resistant resin composition to form patterns
FUJITSU LTD11 citations73
US5362359ANov 8, 1994
Circuit board and process for producing same
FUJITSU LTD14 citations73
US5236772AAug 17, 1993
Circuit board and process for producing same
FUJITSU LTD7 citations73
US4941918AJul 17, 1990
Sintered magnesium-based composite material and process for preparing same
FUJITSU LTD17 citations72