Inventor

MITANI TSUTOMU

JP31 patents

⚠️ This page may combine multiple inventors who share the name “MITANI TSUTOMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITANI TSUTOMU

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Plasma CVD apparatus and method for forming a diamond like carbon film

Semiconductor device including wiring board with three dimensional wiring pattern

Semiconductor device including a wiring board and semiconductor elements mounted thereon

Magnetic recording media

Substrate on which bumps are formed and method of forming the same

Electronic part, an electronic part mounting element and a process for manufacturing such the articles

Conductive adhesive and connection structure using the same

Electronic component mounted member and repair method thereof

Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module

Method of synthesizing diamond-like carbon thin films

Apparatus for forming a diamond-like thin film

Plasma CVD apparatus and method therefor

Method of and apparatus for synthesizing diamondlike thin film

Magnetic recording medium

Electronic component mounted member and repair method thereof

Photosensitive element used in electrophotography

Magnetic recording medium and method of producing the same

Method for producing mounting structure for an electronic component

Conductive adhesive and packaging structure using the same

Magnetic tape driving mechanism having a capstan with a surface made of carbon film including diamond-bonded carbons

Method for forming thin film and apparatus therefor

Substrate on which bumps are formed and method of forming the same

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

Mounting structure for an electronic component and method for producing the same

Conductive adhesive and packaging structure using the same

Mounting structure for an electronic component and method for producing the same

Conductive adhesive and connection structure using the same

PANASONIC CORP

Module and mounted structure using the same

Module and mounted structure using the same

MATSUSHITA ELECTRIC INDUSTIRAL

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure