Inventor
LOEWENHARDT PETER
US35 patents
⚠️ This page may combine multiple inventors who share the name “LOEWENHARDT PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS6418874B1Jul 16, 2002
Toroidal plasma source for plasma processing
APPLIED MATERIALS INC272 citations97
US6352049B1Mar 5, 2002
Plasma assisted processing chamber with separate control of species density
APPLIED MATERIALS INC498 citations96
US5817534AOct 6, 1998
RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers
APPLIED MATERIALS INC94 citations96
US6471822B1Oct 29, 2002
Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma
APPLIED MATERIALS INC88 citations95
US6071372AJun 6, 2000
RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
APPLIED MATERIALS INC69 citations95
US5753044AMay 19, 1998
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC91 citations95
US6270617B1Aug 7, 2001
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC48 citations94
US6085688AJul 11, 2000
Method and apparatus for improving processing and reducing charge damage in an inductively coupled plasma reactor
APPLIED MATERIALS INC52 citations94
US5801386ASep 1, 1998
Apparatus for measuring plasma characteristics within a semiconductor wafer processing system and a method of fabricating and using same
APPLIED MATERIALS INC36 citations92
US5565681AOct 15, 1996
Ion energy analyzer with an electrically controlled geometric filter
APPLIED MATERIALS INC31 citations92
US6270687B1Aug 7, 2001
RF plasma method
APPLIED MATERIALS INC42 citations91
US6247425B1Jun 19, 2001
Method and apparatus for improving processing and reducing charge damage in an inductively coupled plasma reactor
APPLIED MATERIALS INC28 citations91
US6475335B1Nov 5, 2002
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC18 citations90
US6712020B2Mar 30, 2004
Toroidal plasma source for plasma processing
APPLIED MATERIALS INC15 citations82
US6581612B1Jun 24, 2003
Chamber cleaning with fluorides of iodine
APPLIED MATERIALS INC15 citations80
US6822185B2Nov 23, 2004
Temperature controlled dome-coil system for high power inductively coupled plasma systems
APPLIED MATERIALS INC7 citations73
LAM RES CORP
15 patentsUS7244336B2Jul 17, 2007
Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
LAM RES CORP67 citations98
US6841943B2Jan 11, 2005
Plasma processor with electrode simultaneously responsive to plural frequencies
LAM RES CORP115 citations96
US7169231B2Jan 30, 2007
Gas distribution system with tuning gas
LAM RES CORP47 citations95
US6744212B2Jun 1, 2004
Plasma processing apparatus and method for confining an RF plasma under very high gas flow and RF power density conditions
LAM RES CORP94 citations95
US7861667B2Jan 4, 2011
Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a multi-part electrode
LAM RES CORP23 citations92
US7601246B2Oct 13, 2009
Methods of sputtering a protective coating on a semiconductor substrate
LAM RES CORP56 citations92
US7597816B2Oct 6, 2009
Wafer bevel polymer removal
LAM RES CORP21 citations92
US7371332B2May 13, 2008
Uniform etch system
LAM RES CORP29 citations92
US7294580B2Nov 13, 2007
Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition
LAM RES CORP29 citations92
US6949460B2Sep 27, 2005
Line edge roughness reduction for trench etch
LAM RES CORP25 citations90
US7226852B1Jun 5, 2007
Preventing damage to low-k materials during resist stripping
LAM RES CORP13 citations82
US7976673B2Jul 12, 2011
RF pulsing of a narrow gap capacitively coupled reactor
LAM RES CORP4 citations63
US7041230B2May 9, 2006
Method for selectively etching organosilicate glass with respect to a doped silicon carbide
LAM RES CORP0 citations51
US7385287B2Jun 10, 2008
Preventing damage to low-k materials during resist stripping
LAM RES CORP1 citations50
US7211518B2May 1, 2007
Waferless automatic cleaning after barrier removal
LAM RES CORP0 citations47