Inventor
KODNANI RAMESH R
US20 patents
Patents
20 patentsUS6206997B1Mar 27, 2001
Method for bonding heat sinks to overmolds and device formed thereby
IBM36 citations96
US5973389AOct 26, 1999
Semiconductor chip carrier assembly
IBM68 citations95
US5889321AMar 30, 1999
Stiffeners with improved adhesion to flexible substrates
IBM75 citations95
US6596559B2Jul 22, 2003
Flip-chip package with optimized encapsulant adhesion and method
IBM17 citations92
US6193576B1Feb 27, 2001
TFT panel alignment and attachment method and apparatus
IBM19 citations92
US6174406B1Jan 16, 2001
Bonding together surfaces
IBM16 citations92
US6129804AOct 10, 2000
TFT panel alignment and attachment method and apparatus
IBM36 citations92
US6719871B2Apr 13, 2004
Method for bonding heat sinks to overmolds and device formed thereby
IBM10 citations74
US6639638B1Oct 28, 2003
LCD cover optical structure and method
IBM10 citations74
US6576996B2Jun 10, 2003
Method for bonding heat sinks to overmolds and device formed thereby
IBM8 citations74
US6713858B2Mar 30, 2004
Flip-chip package with optimized encapsulant adhesion and method
IBM5 citations73
US6517662B2Feb 11, 2003
Process for making semiconductor chip assembly
IBM11 citations73
US6487461B1Nov 26, 2002
TFT panel alignment and attachment method and apparatus
IBM8 citations73
US6444407B1Sep 3, 2002
Plate for liquid crystal display, method and polymeric compositions
IBM9 citations73
US6248614B1Jun 19, 2001
Flip-chip package with optimized encapsulant adhesion and method
IBM9 citations73
US6458005B1Oct 1, 2002
Selectively compliant chuck for LCD assembly
IBM8 citations69
US6770968B2Aug 3, 2004
Method for bonding heat sinks to overmolds and device formed thereby
IBM2 citations63
US6447885B1Sep 10, 2002
Bonding together surfaces
IBM1 citations63
US6344099B1Feb 5, 2002
TFT panel alignment and attachment method and apparatus
IBM3 citations62
US6835441B1Dec 28, 2004
Bonding together surfaces
IBM0 citations52