Inventor
MIZUNOYA NOBUYUKI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “MIZUNOYA NOBUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
22 patentsUS5328751AJul 12, 1994
Ceramic circuit board with a curved lead terminal
TOSHIBA KK61 citations96
US4770953ASep 13, 1988
Aluminum nitride sintered body having conductive metallized layer
TOSHIBA KK87 citations96
US4901137AFeb 13, 1990
Electronic apparatus having semiconductor device
TOSHIBA KK29 citations93
US6284985B1Sep 4, 2001
Ceramic circuit board with a metal plate projected to prevent solder-flow
TOSHIBA KK41 citations92
US6040039AMar 21, 2000
Silicon nitride circuit board
TOSHIBA KK27 citations92
US5998000ADec 7, 1999
Silicon nitride circuit board
TOSHIBA KK23 citations92
US5928768AJul 27, 1999
Silicon nitride circuit board
TOSHIBA KK32 citations92
US5744410AApr 28, 1998
High thermal conductive silicon nitride sintered body, method of producing the same and press-contacted body
TOSHIBA KK20 citations92
US5165983ANov 24, 1992
Method for production of aluminum nitride ceramic plate
TOSHIBA KK26 citations92
US5063121ANov 5, 1991
Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
TOSHIBA KK39 citations92
US4987677AJan 29, 1991
Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK22 citations92
US4761345AAug 2, 1988
Aluminum nitride substrate
TOSHIBA KK25 citations92
US4704320ANov 3, 1987
Substrate structure
TOSHIBA KK38 citations90
US6316116B1Nov 13, 2001
Ceramic circuit board and method of manufacturing the same
TOSHIBA KK16 citations82
US4959507ASep 25, 1990
Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK20 citations81
US4883704ANov 28, 1989
Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
TOSHIBA KK20 citations81
US5363278ANov 8, 1994
Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK11 citations74
US5155665AOct 13, 1992
Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK11 citations74
US4835065AMay 30, 1989
Composite alumina-aluminum nitride circuit substrate
TOSHIBA KK9 citations74
US4954386ASep 4, 1990
Joined ceramic-metal composite substrate and method for production thereof
TOSHIBA KK14 citations73
US4906511AMar 6, 1990
Aluminum nitride circuit board
TOSHIBA KK11 citations71
US4873151AOct 10, 1989
Aluminum nitride circuit substrate
TOSHIBA KK6 citations63