Inventor
YOKOTA TADAHIKO
JP27 patents
⚠️ This page may combine multiple inventors who share the name “YOKOTA TADAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AJINOMOTO KK
23 patentsUS6403221B1Jun 11, 2002
Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
AJINOMOTO KK133 citations99
US6805958B2Oct 19, 2004
Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
AJINOMOTO KK52 citations96
US6739040B1May 25, 2004
Method of manufacturing multilayered printed wiring board using adhesive film
AJINOMOTO KK55 citations96
US5430112AJul 4, 1995
Epoxy resin and polythiol composition
AJINOMOTO KK127 citations96
US6376053B1Apr 23, 2002
Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same
AJINOMOTO KK30 citations92
US6133377AOct 17, 2000
Compostion of epoxy resin, phenol-triazine-aldehyde condensate and rubber
AJINOMOTO KK26 citations92
US6335417B1Jan 1, 2002
Modified polyimide resin and thermosetting resin composition containing the same
AJINOMOTO KK29 citations91
US6124023ASep 26, 2000
Prepreg for laminate and process for producing printed wiring-board using the same
AJINOMOTO KK42 citations91
US5439977AAug 8, 1995
Acid anhydride-containing one package of epoxy resin composition
AJINOMOTO KK36 citations91
US7208062B2Apr 24, 2007
Method of producing multilayer printed wiring board
AJINOMOTO KK17 citations84
US6881293B2Apr 19, 2005
Process for producing a multi-layer printer wiring board
AJINOMOTO KK15 citations84
US8382996B2Feb 26, 2013
Metal-clad laminate
AJINOMOTO KK8 citations82
US5723262AMar 3, 1998
Resin composition
AJINOMOTO KK17 citations82
US7037586B2May 2, 2006
Film for circuit board
AJINOMOTO KK9 citations74
US6818702B1Nov 16, 2004
Thermosetting resin composition and flexible circuit overcoating material comprising the same
AJINOMOTO KK11 citations73
US4874542AOct 17, 1989
Phenyl-pyrimidine liquid crystal compounds and liquid crystal compositions containing the same
AJINOMOTO KK7 citations73
US6380343B1Apr 30, 2002
Curable resin composition for overcoat of flexible circuit
AJINOMOTO KK9 citations72
US6162889ADec 19, 2000
Curable resin composition for overcoat of flexible circuit
AJINOMOTO KK15 citations72
US4892676AJan 9, 1990
Phenyl pyrimidine compound and liquid crystalline composition
AJINOMOTO KK6 citations71
US9516765B2Dec 6, 2016
Method for producing printed wiring board
AJINOMOTO KK4 citations67
US6221972B1Apr 24, 2001
Photosensitive resin and photosensitive resin composition containing the same
AJINOMOTO KK5 citations63
US8357443B2Jan 22, 2013
Laminate including water soluble release layer for producing circuit board and method of producing circuit board
AJINOMOTO KK4 citations61
US6376609B2Apr 23, 2002
Photosensitive resin and photosensitive resin composition containing the same
AJINOMOTO KK1 citations52