Inventor

YONG OH-SE

KR2 patents

Patents

2 patents

US7015590B2Mar 21, 2006

Reinforced solder bump structure and method for forming a reinforced solder bump

SAMSUNG ELECTRONICS CO LTD119 citations97

US7271084B2Sep 18, 2007

Reinforced solder bump structure and method for forming a reinforced solder bump

SAMSUNG ELECTRONICS CO LTD26 citations91