Inventor
KIM SOON-BUM
KR9 patents
⚠️ This page may combine multiple inventors who share the name “KIM SOON-BUM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7151009B2Dec 19, 2006
Method for manufacturing wafer level chip stack package
SAMSUNG ELECTRONICS CO LTD356 citations97
US7015590B2Mar 21, 2006
Reinforced solder bump structure and method for forming a reinforced solder bump
SAMSUNG ELECTRONICS CO LTD119 citations97
US7307342B2Dec 11, 2007
Interconnection structure of integrated circuit chip
SAMSUNG ELECTRONICS CO LTD16 citations92
US7271084B2Sep 18, 2007
Reinforced solder bump structure and method for forming a reinforced solder bump
SAMSUNG ELECTRONICS CO LTD26 citations91
US7214604B2May 8, 2007
Method of fabricating ultra thin flip-chip package
SAMSUNG ELECTRONICS CO LTD17 citations84
US7855144B2Dec 21, 2010
Method of forming metal lines and bumps for semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations73
US7732319B2Jun 8, 2010
Interconnection structure of integrated circuit chip
SAMSUNG ELECTRONICS CO LTD2 citations62
US7524763B2Apr 28, 2009
Fabrication method of wafer level chip scale packages
SAMSUNG ELECTRONICS CO LTD4 citations61