Inventor
LYU JU-HYUN
KR4 patents
Patents
4 patentsUS7015590B2Mar 21, 2006
Reinforced solder bump structure and method for forming a reinforced solder bump
SAMSUNG ELECTRONICS CO LTD119 citations97
US6878570B2Apr 12, 2005
Thin stacked package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD83 citations96
US6849949B1Feb 1, 2005
Thin stacked package
SAMSUNG ELECTRONICS CO LTD108 citations96
US7271084B2Sep 18, 2007
Reinforced solder bump structure and method for forming a reinforced solder bump
SAMSUNG ELECTRONICS CO LTD26 citations91