Inventor
BONGES III HENRY A
US10 patents
⚠️ This page may combine multiple inventors who share the name “BONGES III HENRY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS5313424AMay 17, 1994
Module level electronic redundancy
IBM157 citations98
US7067886B2Jun 27, 2006
Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage
IBM95 citations97
US7132318B2Nov 7, 2006
Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage
IBM9 citations73
US7299426B2Nov 20, 2007
System and method to improve chip yield, reliability and performance
IBM6 citations72
US7120887B2Oct 10, 2006
Cloned and original circuit shape merging
IBM5 citations62
US5101120AMar 31, 1992
BiCMOS output driver
IBM6 citations61
US7941780B2May 10, 2011
Intersect area based ground rule for semiconductor design
IBM2 citations59
US7275226B2Sep 25, 2007
Method of performing latch up check on an integrated circuit design
IBM0 citations38