Inventor
TYBERG CHRISTY S
US31 patents
⚠️ This page may combine multiple inventors who share the name “TYBERG CHRISTY S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
25 patentsUS7394089B2Jul 1, 2008
Heat-shielded low power PCM-based reprogrammable EFUSE device
IBM76 citations98
US7388273B2Jun 17, 2008
Reprogrammable fuse structure and method
IBM73 citations98
US7365378B2Apr 29, 2008
MOSFET structure with ultra-low K spacer
IBM32 citations92
US7057287B2Jun 6, 2006
Dual damascene integration of ultra low dielectric constant porous materials
IBM34 citations92
US6982227B2Jan 3, 2006
Single and multilevel rework
IBM16 citations91
US6674168B1Jan 6, 2004
Single and multilevel rework
IBM17 citations91
US7960808B2Jun 14, 2011
Reprogrammable fuse structure and method
IBM8 citations84
US7407879B2Aug 5, 2008
Chemical planarization performance for copper/low-k interconnect structures
IBM10 citations84
US7338895B2Mar 4, 2008
Method for dual damascene integration of ultra low dielectric constant porous materials
IBM9 citations84
US6783862B2Aug 31, 2004
Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
IBM12 citations82
US7737561B2Jun 15, 2010
Dual damascene integration of ultra low dielectric constant porous materials
IBM5 citations74
US7491965B2Feb 17, 2009
Heat-shielded low power PCM-based reprogrammable eFUSE device
IBM6 citations74
US7187081B2Mar 6, 2007
Polycarbosilane buried etch stops in interconnect structures
IBM7 citations74
US6933586B2Aug 23, 2005
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
IBM11 citations74
US6844257B2Jan 18, 2005
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
IBM5 citations74
US6638878B2Oct 28, 2003
Film planarization for low-k polymers used in semiconductor structures
IBM10 citations74
US7071539B2Jul 4, 2006
Chemical planarization performance for copper/low-k interconnect structures
IBM8 citations73
US8017522B2Sep 13, 2011
Mechanically robust metal/low-κ interconnects
IBM5 citations71
US7755921B2Jul 13, 2010
Method and apparatus for fabricating sub-lithography data tracks for use in magnetic shift register memory devices
IBM5 citations63
US7396758B2Jul 8, 2008
Polycarbosilane buried etch stops in interconnect structures
IBM4 citations63
US6818285B2Nov 16, 2004
Composition and method to achieve reduced thermal expansion in polyarylene networks
IBM3 citations58
US7879717B2Feb 1, 2011
Polycarbosilane buried etch stops in interconnect structures
IBM0 citations52
US7598169B2Oct 6, 2009
Method to remove beol sacrificial materials and chemical residues by irradiation
IBM1 citations52
US7329600B2Feb 12, 2008
Low dielectric semiconductor device and process for fabricating the same
IBM1 citations52
US6864180B2Mar 8, 2005
Method for reworking low-k polymers used in semiconductor structures
IBM0 citations49