Inventor
UENO KAZUYOSHI
JP34 patents
⚠️ This page may combine multiple inventors who share the name “UENO KAZUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
14 patentsUS6245676B1Jun 12, 2001
Method of electroplating copper interconnects
NEC CORP59 citations96
US6221765B1Apr 24, 2001
Method for manufacturing a semiconductor device
NEC CORP56 citations96
US5696017ADec 9, 1997
Method of fabricating a semiconductor device with a capacitor structure having increased capacitance
NEC CORP85 citations96
US6482741B1Nov 19, 2002
Copper wiring structure comprising a copper material buried in a hollow of an insulating film and a carbon layer between the hollow and the copper material in semiconductor device and method fabricating the same
NEC CORP18 citations92
US6391168B1May 21, 2002
Plating apparatus utilizing an auxiliary electrode
NEC CORP29 citations92
US5521424AMay 28, 1996
Semiconductor device having a silicon oxide film containing fluorine atoms
NEC CORP29 citations92
US5227644AJul 13, 1993
Heterojunction field effect transistor with improve carrier density and mobility
NEC CORP29 citations92
US6670639B1Dec 30, 2003
Copper interconnection
NEC CORP18 citations91
US6486559B1Nov 26, 2002
Copper wiring structure comprising a copper material buried in a hollow of an insulating film and a carbon layer between the hollow and the copper material in semiconductor device and method of fabricating the same
NEC CORP12 citations74
US6478935B1Nov 12, 2002
Semiconductor device plating apparatus
NEC CORP8 citations74
US6268090B1Jul 31, 2001
Process for manufacturing semiconductor device and exposure mask
NEC CORP14 citations73
US6472318B2Oct 29, 2002
Method of fabricating semiconductor device having trench interconnection
NEC CORP6 citations63
US4980750ADec 25, 1990
Semiconductor crystal
NEC CORP3 citations63
US5098858AMar 24, 1992
Junction between metal and zincblende-type III-V compound semiconductor and manufacturing method thereof
NEC CORP2 citations62
NEC ELECTRONICS CORP
13 patentsUS7138700B2Nov 21, 2006
Semiconductor device with guard ring for preventing water from entering circuit region from outside
NEC ELECTRONICS CORP26 citations92
US7479700B2Jan 20, 2009
Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same
NEC ELECTRONICS CORP10 citations84
US7332813B2Feb 19, 2008
Semiconductor device
NEC ELECTRONICS CORP16 citations84
US7259095B2Aug 21, 2007
Semiconductor device and manufacturing process therefor as well as plating solution
NEC ELECTRONICS CORP12 citations84
US6680247B2Jan 20, 2004
Manufacturing method of a semiconductor device
NEC ELECTRONICS CORP9 citations74
US6670270B1Dec 30, 2003
Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
NEC ELECTRONICS CORP12 citations74
US7741214B2Jun 22, 2010
Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon
NEC ELECTRONICS CORP3 citations63
US7485566B2Feb 3, 2009
Method of manufacturing semiconductor device
NEC ELECTRONICS CORP2 citations61
US7821135B2Oct 26, 2010
Semiconductor device with improved stress migration resistance and manufacturing process therefor
NEC ELECTRONICS CORP1 citations52
US7566973B2Jul 28, 2009
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP0 citations52
US7563696B2Jul 21, 2009
Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
NEC ELECTRONICS CORP0 citations52
US7220318B2May 22, 2007
Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
NEC ELECTRONICS CORP0 citations52
US6765294B1Jul 20, 2004
Semiconductor device including dual-damascene structure and method for manufacturing the same
NEC ELECTRONICS CORP0 citations52
IMV LAB
4 patentsUS6377900B1Apr 23, 2002
Measuring system for transfer function matrix of a system to be controlled in multi-degree of freedom vibration control
IMV LAB27 citations89
US5012428AApr 30, 1991
Vibration control system
IMV LAB47 citations86
US12264998B2Apr 1, 2025
Vibration control system
IMV LAB0 citations56
US11879816B2Jan 23, 2024
Vibration control system
IMV LAB0 citations56