Inventor
TENG WEN-YI
TW15 patents
⚠️ This page may combine multiple inventors who share the name “TENG WEN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
10 patentsUS8709901B1Apr 29, 2014
Method of forming an isolation structure
UNITED MICROELECTRONICS CORP26 citations92
US8937369B2Jan 20, 2015
Transistor with non-uniform stress layer with stress concentrated regions
UNITED MICROELECTRONICS CORP7 citations83
US9362358B2Jun 7, 2016
Spatial semiconductor structure
UNITED MICROELECTRONICS CORP6 citations81
US8927388B2Jan 6, 2015
Method of fabricating dielectric layer and shallow trench isolation
UNITED MICROELECTRONICS CORP4 citations72
US11705492B2Jul 18, 2023
Method for fabricating semiconductor structure
UNITED MICROELECTRONICS CORP0 citations61
US11031477B2Jun 8, 2021
Method for fabricating semiconductor structure
UNITED MICROELECTRONICS CORP0 citations61
US10541309B2Jan 21, 2020
Semiconductor structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations51
US9343573B2May 17, 2016
Method of fabrication transistor with non-uniform stress layer with stress concentrated regions
UNITED MICROELECTRONICS CORP0 citations51
US7678588B2Mar 16, 2010
Method for constructing module for optical critical dimension (OCD) and measuring method of module for optical critical dimension using the module
UNITED MICROELECTRONICS CORP1 citations50
US9105582B2Aug 11, 2015
Spatial semiconductor structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations49