Inventor

LINIGER ERIC G

US22 patents

⚠️ This page may combine multiple inventors who share the name “LINIGER ERIC G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LINIGER ERIC G

IBM

Air gap spacer formation for nano-scale semiconductor devices

Air gap spacer formation for nano-scale semiconductor devices

Method and system for dicing wafers, and semiconductor structures incorporating the products thereof

Method of making an edge seal for a semiconductor device

Method and system for dicing wafers, and semiconductor structures incorporating the products thereof

Edge seal for a semiconductor device

Mechanical strength die sorting

Air gap spacer formation for nano-scale semiconductor devices

Method of forming crack trapping and arrest in thin film structures

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Nanoscale interconnect structure

Semiconductor structure and package including a chip having chamfered edges

Crack trapping and arrest in thin film structures

Predicting semiconductor package warpage

Nanoscale interconnect structure

Strengthening of a structure by infiltration

Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties

Predicting semiconductor package warpage

SONY CORP

Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties

TESSERA LLC

Air gap spacer formation for nano-scale semiconductor devices

LINIGER ERIC G

Multiple step anneal method and semiconductor formed by multiple step anneal

ADEIA SEMICONDUCTOR SOLUTIONS LLC

Air gap spacer formation for nano-scale semiconductor devices