Inventor

CHEONG MARY ANNIE

SG4 patents

⚠️ This page may combine multiple inventors who share the name “CHEONG MARY ANNIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED TEST & ASSEMBLY CT LTD

1 patent

US7723833B2May 25, 2010

Stacked die packages

UNITED TEST & ASSEMBLY CT LTD5 citations60

UNITED TEST & ASSEMBLY CT LT

1 patent

US8030768B2Oct 4, 2011

Semiconductor package with under bump metallization aligned with open vias

UNITED TEST & ASSEMBLY CT LT2 citations54

UNITED TEST AND ASSEMBLY CENTER LTD

1 patent

US9842792B2Dec 12, 2017

Method of producing a semiconductor package

UNITED TEST AND ASSEMBLY CENTER LTD0 citations46

RETUTA DANNY

1 patent

US9281218B2Mar 8, 2016

Method of producing a semiconductor package

RETUTA DANNY0 citations41