Inventor

HORIBE AKIHIRO

JP51 patents

⚠️ This page may combine multiple inventors who share the name “HORIBE AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HORIBE AKIHIRO

IBM

Single-mode polymer waveguide connector assembly

Alignment method for circular multi-core optical fiber

Debonding chips from wafer

Multi-chip package assembly

Underfill injection for electronic devices

Controlling of height of high-density interconnection structure on substrate

High-density interconnecting adhesive tape

High-density interconnecting adhesive tape

Multi-chip package assembly

Polymer waveguide (PWG) connector assembly having both cores and cladding partially exposed

Polymer waveguide connector assembly method using cores and cladding that are both partially exposed

Optical device with precoated underfill

Forming a solder joint between metal layers

Liquid crystal display device and display device

Single-mode polymer waveguide connector assembly

Chip mounting structure

Bonding of bridge to multiple semiconductor chips

Interconnection between chips by bridge chip

Controlling of height of high-density interconnection structure on substrate

Silicon handler with laser-release layers

Interconnection between chips by bridge chip

Bonding of bridge to multiple semiconductor chips

Large capacity solid state battery

Sampling of breath gas

Large capacity solid state battery

Stacked film battery architecture

Stacked film battery architecture

Wafer scale testing and initialization of small die chips

Reduction of stress in via structure

Illuminator, liquid crystal display comprising it and lamp socket

Electron device stack structure

Multichip interconnect package

Underfill vacuum process

Vertical transmon structure and its fabrication process

Stacked device structure

Wafer scale testing and initialization of small die chips

Picking up irregular semiconductor chips

Stacked film battery architecture

Solder fill into high aspect through holes

Solder fill into high aspect through holes

Chip mounting structure

Semiconductor structure including a through electrode, and method for forming the same

Semiconductor structure including a through electrode, and method for forming the same

Circuit module and manufacturing method thereof

Forming a solder joint between metal layers

Circuit module and manufacturing method thereof

Multichip interconnect package fine jet underfill

NITTO JUSHI KOGYO KABUSHIKI KA

Tandem lighting panel

ENPLAS CORP

Light source device with uniformity in color temperature of emission

TESSERA INC

Reduction of stress in via structure