P

Inventor

GRIMARD DENNIS S

US25 patents
⚠️ This page may combine multiple inventors who share the name “GRIMARD DENNIS S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

21 patents
US6108189AAug 22, 2000

Electrostatic chuck having improved gas conduits

APPLIED MATERIALS INC255 citations99
US6095084AAug 1, 2000

High density plasma process chamber

APPLIED MATERIALS INC250 citations99
US6721162B2Apr 13, 2004

Electrostatic chuck having composite dielectric layer and method of manufacture

APPLIED MATERIALS INC76 citations98
US6320736B1Nov 20, 2001

Chuck having pressurized zones of heat transfer gas

APPLIED MATERIALS INC122 citations98
US6310755B1Oct 30, 2001

Electrostatic chuck having gas cavity and method

APPLIED MATERIALS INC325 citations98
US6074488AJun 13, 2000

Plasma chamber support having an electrically coupled collar ring

APPLIED MATERIALS INC118 citations98
US5903428AMay 11, 1999

Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same

APPLIED MATERIALS INC300 citations98
US6538872B1Mar 25, 2003

Electrostatic chuck having heater and method

APPLIED MATERIALS INC123 citations97
US6490146B2Dec 3, 2002

Electrostatic chuck bonded to base with a bond layer and method

APPLIED MATERIALS INC88 citations97
US6478924B1Nov 12, 2002

Plasma chamber support having dual electrodes

APPLIED MATERIALS INC124 citations97
US6581275B2Jun 24, 2003

Fabricating an electrostatic chuck having plasma resistant gas conduits

APPLIED MATERIALS INC74 citations96
US6490144B1Dec 3, 2002

Support for supporting a substrate in a process chamber

APPLIED MATERIALS INC57 citations96
US6462928B1Oct 8, 2002

Electrostatic chuck having improved electrical connector and method

APPLIED MATERIALS INC65 citations96
US6414834B1Jul 2, 2002

Dielectric covered electrostatic chuck

APPLIED MATERIALS INC56 citations96
US6151203ANov 21, 2000

Connectors for an electrostatic chuck and combination thereof

APPLIED MATERIALS INC76 citations95
US6494958B1Dec 17, 2002

Plasma chamber support with coupled electrode

APPLIED MATERIALS INC74 citations94
US6273958B2Aug 14, 2001

Substrate support for plasma processing

APPLIED MATERIALS INC20 citations92
US7813103B2Oct 12, 2010

Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodes

APPLIED MATERIALS INC14 citations84
US7510665B2Mar 31, 2009

Plasma generation and control using dual frequency RF signals

APPLIED MATERIALS INC17 citations84
US7838430B2Nov 23, 2010

Plasma control using dual cathode frequency mixing

APPLIED MATERIALS INC8 citations83
US6642489B2Nov 4, 2003

Method and apparatus for improving exhaust gas consumption in an exhaust conduit

APPLIED MATERIALS INC2 citations62

WATLOW ELECTRIC MFG

2 patents

IBM

1 patent

(unassigned)

1 patent