Inventor

TSUBOTA YASUTOSHI

JP16 patents

⚠️ This page may combine multiple inventors who share the name “TSUBOTA YASUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

10 patents

US12374527B2Jul 29, 2025

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations61

US11869748B2Jan 9, 2024

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations61

US12154826B2Nov 26, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations59

US11664275B2May 30, 2023

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP1 citations59

US12040161B2Jul 16, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations58

US11908682B2Feb 20, 2024

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations58

US11081362B2Aug 3, 2021

Method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP0 citations58

US11189483B2Nov 30, 2021

Method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations49

US12575347B2Mar 10, 2026

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations48

US10796900B2Oct 6, 2020

Method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations39

HITACHI INT ELECTRIC INC

4 patents

US9147573B2Sep 29, 2015

Substrate processing apparatus and method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC2 citations60

US9518321B2Dec 13, 2016

Atomic layer deposition processing apparatus to reduce heat energy conduction

HITACHI INT ELECTRIC INC1 citations51

US9472424B2Oct 18, 2016

Substrate processing apparatus and a method of manufacturing a semiconductor device

HITACHI INT ELECTRIC INC0 citations50

US9974191B2May 15, 2018

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

HITACHI INT ELECTRIC INC0 citations39

CENTRAL GLASS CO LTD

1 patent

US10153153B2Dec 11, 2018

Method for removing adhering matter and dry etching method

CENTRAL GLASS CO LTD3 citations70

HAMANO KATSUYOSHI

1 patent

US9236246B2Jan 12, 2016

Substrate processing apparatus and a method of manufacturing a semiconductor device

HAMANO KATSUYOSHI4 citations66