Inventor
PARK SANGCHEON
KR12 patents
Patents
12 patentsUS11289438B2Mar 29, 2022
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD5 citations82
US12266638B2Apr 1, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations74
US12327784B2Jun 10, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11749662B2Sep 5, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11621247B2Apr 4, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11658141B2May 23, 2023
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US12132019B2Oct 29, 2024
Packaged multi-chip semiconductor devices and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12094867B2Sep 17, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11552033B2Jan 10, 2023
Packaged multi-chip semiconductor devices and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD1 citations62
US12080691B2Sep 3, 2024
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations60
US11824045B2Nov 21, 2023
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12538848B2Jan 27, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50