Inventor

MAHULIKAR DEEPAK

US82 patents

⚠️ This page may combine multiple inventors who share the name “MAHULIKAR DEEPAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAHULIKAR DEEPAK

OLIN CORP

Molded plastic semiconductor package including heat spreader

Metal ball grid array package with improved thermal conductivity

Electronic package with improved electrical performance

Semiconductor package

Lead-free bullett

Molded plastic semiconductor package including an aluminum alloy heat spreader

Components for housing an integrated circuit device

Adhesively sealed metal electronic package incorporating a multi-chip module

Lead frames with improved adhesion to a polymer

Metal electronic package with reduced seal width

Lead frames having a chromium and zinc alloy coating

Metal electronic package with reduced seal width

Process for manufacturing a metal pin grid array package

Metal packages having improved thermal dissipation

Aluminum alloy semiconductor packages

Electronic packaging of components incorporating a ceramic-glass-metal composite

Hermetically sealed package

Electronic package with stress relief channel

Metal electronic package having improved resistance to electromagnetic interference

Thermal performance package for integrated circuit chip

Metal electronic package

Semiconductor die attach system

Lead-free shot

Anodized aluminum substrate having increased breakdown voltage

Electronic package having improved wire bonding capability

Lead frame having polymer coated surface portions

Process for producing black integrally colored anodized aluminum components

Articles using specialized vapor deposition processes

Leadframe having exposed, solderable outer lead ends

Method for the assembly of an electronic package

Metal pin grid array package

Process for treating copper-nickel alloys for use in brazed assemblies and product

Cermet substrate with glass adhesion component

Ferromagnetic bullet

Aluminum alloy semiconductor packages

Surface modified copper alloys

Electronic packaging of components incorporating a ceramic-glass-metal composite

Aluminum alloy semiconductor packages

Projectile having improved baseplug

Kit for the assembly of a metal electronic package

Semiconductor die attach system

Graded sealing systems for semiconductor package

Anodized aluminum substrate having increased breakdown voltage

Polymer plug for electronic packages

ARCH SPEC CHEM INC

Chemical mechanical polishing slurry system having an activator solution

Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys

Ready-to-use stable chemical-mechanical polishing slurries

ADVANCED INTERCONNECT TECH LTD

Ball grid array electronic package

Metal ball grid electronic package having improved solder joint

ADVANCED TECHNOLOGY INTERCONNE

Semiconductor package with molded plastic body