Inventor
HAN SEUNG
KR19 patents
⚠️ This page may combine multiple inventors who share the name “HAN SEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG SDI CO LTD
14 patentsUS11609494B2Mar 21, 2023
Semiconductor photoresist composition and method of forming patterns using the composition
SAMSUNG SDI CO LTD5 citations73
US12013635B2Jun 18, 2024
Semiconductor photoresist composition and method of forming patterns using the composition
SAMSUNG SDI CO LTD2 citations69
US12158699B2Dec 3, 2024
Semiconductor photoresist composition and method of forming patterns using the composition
SAMSUNG SDI CO LTD1 citations59
US9890307B2Feb 13, 2018
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
SAMSUNG SDI CO LTD0 citations50
US12538761B2Jan 27, 2026
Composition for semiconductor photoresist, and pattern formation method using same
SAMSUNG SDI CO LTD0 citations49
US12306534B2May 20, 2025
Semiconductor photoresist composition and method of forming patterns using the composition
SAMSUNG SDI CO LTD0 citations49
US11415885B2Aug 16, 2022
Semiconductor photoresist composition, and method of forming patterns using the composition
SAMSUNG SDI CO LTD0 citations49
US9153513B2Oct 6, 2015
Epoxy resin composition and semiconductor apparatus prepared using the same
SAMSUNG SDI CO LTD0 citations42
US10047191B2Aug 14, 2018
Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same
SAMSUNG SDI CO LTD0 citations40
US9957348B2May 1, 2018
Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same
SAMSUNG SDI CO LTD0 citations40
US9890238B2Feb 13, 2018
Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same
SAMSUNG SDI CO LTD0 citations40
US9870971B2Jan 16, 2018
Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
SAMSUNG SDI CO LTD0 citations39
US9850390B2Dec 26, 2017
Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
SAMSUNG SDI CO LTD0 citations39
US9896465B2Feb 20, 2018
Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
SAMSUNG SDI CO LTD0 citations34
KIM MIN GYUM
2 patentsUS9428632B2Aug 30, 2016
Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition
KIM MIN GYUM1 citations45
US9695294B2Jul 4, 2017
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
KIM MIN GYUM0 citations35
HAN SEUNG
2 patentsUS8531044B2Sep 10, 2013
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
HAN SEUNG0 citations45
US8928158B2Jan 6, 2015
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
HAN SEUNG0 citations44