Inventor
FU SHIH-KANG
TW16 patents
⚠️ This page may combine multiple inventors who share the name “FU SHIH-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS9530737B1Dec 27, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations92
US11742239B2Aug 29, 2023
Methods of performing chemical-mechanical polishing process in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9721894B2Aug 1, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12362233B2Jul 15, 2025
Methods of performing chemical-mechanical polishing process in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12342600B2Jun 24, 2025
Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205886B2Jan 21, 2025
Hybrid method for forming semiconductor interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11810816B2Nov 7, 2023
Chemical mechanical polishing topography reset and control on interconnect metal lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11545389B2Jan 3, 2023
Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11450602B2Sep 20, 2022
Hybrid method for forming semiconductor interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342219B2May 24, 2022
Chemical mechanical polishing topography reset and control on interconnect metal lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152255B2Oct 19, 2021
Methods of performing chemical-mechanical polishing process in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127680B2Sep 21, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10879115B2Dec 29, 2020
Semiconductor device and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11211256B2Dec 28, 2021
Method with CMP for metal ion prevention
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163700B2Dec 25, 2018
Method for forming conductive structure using polishing process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41