Inventor
YAMAZAKI TAKAO
JP51 patents
⚠️ This page may combine multiple inventors who share the name “YAMAZAKI TAKAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
16 patentsUS5666169ASep 9, 1997
Parallel processor apparatus having means for processing signals of different lengths
SONY CORP45 citations96
US4751663AJun 14, 1988
IIR digital filter
SONY CORP28 citations93
US5864706AJan 26, 1999
Digital signal processing apparatus and information processing system
SONY CORP43 citations92
US5389923AFeb 14, 1995
Sampling rate converter
SONY CORP26 citations92
US4677499AJun 30, 1987
Digital time base corrector
SONY CORP33 citations92
US7426462B2Sep 16, 2008
Fast codebook selection method in audio encoding
SONY CORP21 citations87
US4706211ANov 10, 1987
Digital multiplying circuit
SONY CORP22 citations82
US6052705AApr 18, 2000
Video signal processor with triple port memory
SONY CORP8 citations74
US6038350AMar 14, 2000
Signal processing apparatus
SONY CORP15 citations74
US5926583AJul 20, 1999
Signal processing apparatus
SONY CORP8 citations74
US5689450ANov 18, 1997
Parallel processor
SONY CORP13 citations74
US5521855AMay 28, 1996
Multiplying circuit
SONY CORP9 citations74
US4862403AAug 29, 1989
Digital filter
SONY CORP19 citations74
US5134579AJul 28, 1992
Digital adder circuit
SONY CORP12 citations66
US7724820B2May 25, 2010
Method of real time MPEG-4 texture decoding for a multiprocessor environment
SONY CORP3 citations63
US5850268ADec 15, 1998
Parallel processor apparatus
SONY CORP5 citations63
NEC CORP
13 patentsUS6524905B2Feb 25, 2003
Semiconductor device, and thin film capacitor
NEC CORP76 citations98
US6998704B2Feb 14, 2006
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
NEC CORP86 citations97
US6515324B2Feb 4, 2003
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same
NEC CORP59 citations96
US7230328B2Jun 12, 2007
Semiconductor package and laminated semiconductor package
NEC CORP22 citations92
US6703705B2Mar 9, 2004
Semiconductor device and method for packaging same
NEC CORP31 citations92
US7812440B2Oct 12, 2010
Electronic package device, module, and electronic apparatus
NEC CORP9 citations79
US7795585B2Sep 14, 2010
Vacuum package and manufacturing process thereof
NEC CORP7 citations73
US8956915B2Feb 17, 2015
Method of manufacturing a three-dimensional packaging semiconductor device
NEC CORP4 citations71
US6949815B2Sep 27, 2005
Semiconductor device with decoupling capacitors mounted on conductors
NEC CORP4 citations63
US6486540B2Nov 26, 2002
Three-dimensional semiconductor device and method of manufacturing the same
NEC CORP6 citations63
US9157805B2Oct 13, 2015
Infrared ray sensor package, infrared ray sensor module, and electronic device
NEC CORP3 citations62
US7928556B2Apr 19, 2011
Semiconductor device and manufacturing method thereof
NEC CORP0 citations52
US7594644B2Sep 29, 2009
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
NEC CORP0 citations51
YAMAZAKI TAKAO
7 patentsUS8411450B2Apr 2, 2013
Electronic device package, module, and electronic device
YAMAZAKI TAKAO14 citations83
US8525323B2Sep 3, 2013
Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
YAMAZAKI TAKAO12 citations82
US8338940B2Dec 25, 2012
Semiconductor device
YAMAZAKI TAKAO12 citations78
US8785853B2Jul 22, 2014
Infrared sensor package and electronic device equipped therewith
YAMAZAKI TAKAO3 citations62
US8236616B2Aug 7, 2012
Semiconductor device and manufacturing method thereof
YAMAZAKI TAKAO0 citations52
US8093709B2Jan 10, 2012
Semiconductor device and manufacturing method thereof
YAMAZAKI TAKAO0 citations52
US8120921B2Feb 21, 2012
Device having electronic components mounted therein and method for manufacturing such device
YAMAZAKI TAKAO0 citations46
SONY ELECTRONICS INC
2 patentsPIONEER ELECTRONIC CORP
2 patentsNETUREN CO LTD
2 patentsWATANABE SHINJI
2 patentsJSR CORP
1 patentMITSUBISHI JUKOGOYO KABUSHIKI
1 patentNEC ELECTRONICS CORP
1 patentDONALDSON CO INC
1 patentMUHR & BENDER
1 patentSUMITOMO SEI STEEL WIRE CORP
1 patentShowing the top 50 of 51 patents by PatentIndex Score.