Inventor
PATEL SUNIL A
US10 patents
Patents
10 patentsUS6335491B1Jan 1, 2002
Interposer for semiconductor package assembly
LSI LOGIC CORP129 citations98
US6166434ADec 26, 2000
Die clip assembly for semiconductor package
LSI LOGIC CORP128 citations97
US5909057AJun 1, 1999
Integrated heat spreader/stiffener with apertures for semiconductor package
LSI LOGIC CORP142 citations97
US6020221AFeb 1, 2000
Process for manufacturing a semiconductor device having a stiffener member
LSI LOGIC CORP128 citations95
US5998242ADec 7, 1999
Vacuum assisted underfill process and apparatus for semiconductor package fabrication
LSI LOGIC CORP90 citations94
US6618938B1Sep 16, 2003
Interposer for semiconductor package assembly
LSI LOGIC CORP31 citations92
US6306751B1Oct 23, 2001
Apparatus and method for improving ball joints in semiconductor packages
LSI LOGIC CORP27 citations92
US6002171ADec 14, 1999
Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
LSI LOGIC CORP38 citations92
US6466038B1Oct 15, 2002
Non-isothermal electromigration testing of microelectronic packaging interconnects
LSI LOGIC CORP19 citations82
US6433565B1Aug 13, 2002
Test fixture for flip chip ball grid array circuits
LSI LOGIC CORP10 citations73