Inventor
SHIGI HIDETAKA
JP18 patents
⚠️ This page may combine multiple inventors who share the name “SHIGI HIDETAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
16 patentsUS6305230B1Oct 23, 2001
Connector and probing system
HITACHI LTD79 citations95
US5868949AFeb 9, 1999
Metalization structure and manufacturing method thereof
HITACHI LTD93 citations95
US6566150B2May 20, 2003
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD15 citations92
US6506982B1Jan 14, 2003
Multi-layer wiring substrate and manufacturing method thereof
HITACHI LTD39 citations92
US6455335B1Sep 24, 2002
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD17 citations92
US5208656AMay 4, 1993
Multilayer wiring substrate and production thereof
HITACHI LTD23 citations92
US5162240ANov 10, 1992
Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate
HITACHI LTD47 citations92
US4930002AMay 29, 1990
Multi-chip module structure
HITACHI LTD23 citations92
US6124553ASep 26, 2000
Multilayer wiring board having vent holes and method of making
HITACHI LTD17 citations84
US7390732B1Jun 24, 2008
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
HITACHI LTD12 citations83
US6197603B1Mar 6, 2001
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD12 citations82
US5958600ASep 28, 1999
Circuit board and method of manufacturing the same
HITACHI LTD11 citations73
US5262614ANov 16, 1993
Circuit board and sealing structure and methods for manufacturing the same
HITACHI LTD14 citations73
US7285430B2Oct 23, 2007
Connection device and test system
HITACHI LTD3 citations62
US7198962B2Apr 3, 2007
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD3 citations62
US5753372AMay 19, 1998
Wiring structures and method of manufacturing the same
HITACHI LTD3 citations59