Inventor

HER TZONG-DAR

TW11 patents

Patents

11 patents

US6650009B2Nov 18, 2003

Structure of a multi chip module having stacked chips

SILICONWARE PRECISION INDUSTRIES CO LTD102 citations98

US6593662B1Jul 15, 2003

Stacked-die package structure

SILICONWARE PRECISION INDUSTRIES CO LTD203 citations98

US6525942B2Feb 25, 2003

Heat dissipation ball grid array package

SILICONWARE PRECISION INDUSTRIES CO LTD199 citations98

US6218731B1Apr 17, 2001

Tiny ball grid array package

SILICONWARE PRECISION INDUSTRIES CO LTD384 citations98

US6731015B2May 4, 2004

Super low profile package with stacked dies

SILICONWARE PRECISION INDUSTRIES CO LTD23 citations92

US6583499B2Jun 24, 2003

Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package

SILICONWARE PRECISION INDUSTRIES CO LTD31 citations92

US6541854B2Apr 1, 2003

Super low profile package with high efficiency of heat dissipation

SILICONWARE PRECISION INDUSTRIES CO LTD27 citations92

US6713321B2Mar 30, 2004

Super low profile package with high efficiency of heat dissipation

SILICONWARE PRECISION INDUSTRIES CO LTD7 citations73

US6391666B2May 21, 2002

Method for identifying defective elements in array molding of semiconductor packaging

SILICONWARE PRECISION INDUSTRIES CO LTD12 citations72

US6392425B1May 21, 2002

Multi-chip packaging having non-sticking test structure

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations59

US6291260B1Sep 18, 2001

Crack-preventive substrate and process for fabricating solder mask

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations59