Inventor
CHIANG KEVIN
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHIANG KEVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OAK TECHNOLOGY INC
13 patentsUS6594796B1Jul 15, 2003
Simultaneous processing for error detection and P-parity and Q-parity ECC encoding
OAK TECHNOLOGY INC77 citations98
US6587942B1Jul 1, 2003
Circuit for converting input serial data in a plurality of possible formats into output data in parallel format by interpreting input data format indication information
OAK TECHNOLOGY INC20 citations92
US6240525B1May 29, 2001
Method and apparatus for re-addressing defective memory cells
OAK TECHNOLOGY INC23 citations92
US6438503B1Aug 20, 2002
Estimation of device temperature
OAK TECHNOLOGY INC15 citations84
US6574776B1Jun 3, 2003
Simultaneous processing for error detection and P-parity ECC encoding
OAK TECHNOLOGY INC6 citations63
US6532566B1Mar 11, 2003
Modified Reed-Solomon multiplication
OAK TECHNOLOGY INC4 citations63
US6405343B1Jun 11, 2002
ECC Q-parity checkbyte indexing
OAK TECHNOLOGY INC4 citations63
US6378105B1Apr 23, 2002
Reed-Solomon multiplication method
OAK TECHNOLOGY INC3 citations63
US6192424B1Feb 20, 2001
Bus arbiter for facilitating access to a storage medium in enhanced burst mode using freely specifiable address increments/decrements
OAK TECHNOLOGY INC5 citations63
US6405293B1Jun 11, 2002
Selectively accessible memory banks for operating in alternately reading or writing modes of operation
OAK TECHNOLOGY INC5 citations56
US6725420B1Apr 20, 2004
Pattern detection for computer segments
OAK TECHNOLOGY INC0 citations40
US6658068B1Dec 2, 2003
Detection of EFM stream component widths
OAK TECHNOLOGY INC0 citations39
US6560672B1May 6, 2003
Write strategy and timing
OAK TECHNOLOGY INC0 citations39
SILICONWARE PRECISION INDUSTRIES CO LTD
5 patentsUS6359341B1Mar 19, 2002
Ball grid array integrated circuit package structure
SILICONWARE PRECISION INDUSTRIES CO LTD114 citations98
US6218731B1Apr 17, 2001
Tiny ball grid array package
SILICONWARE PRECISION INDUSTRIES CO LTD384 citations98
US6246115B1Jun 12, 2001
Semiconductor package having a heat sink with an exposed surface
SILICONWARE PRECISION INDUSTRIES CO LTD170 citations97
US6552428B1Apr 22, 2003
Semiconductor package having an exposed heat spreader
SILICONWARE PRECISION INDUSTRIES CO LTD168 citations96
US6703691B2Mar 9, 2004
Quad flat non-leaded semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD11 citations74