Inventor
JEONG DO SOO
KR9 patents
⚠️ This page may combine multiple inventors who share the name “JEONG DO SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS6013946AJan 11, 2000
Wire bond packages for semiconductor chips and related methods and assemblies
SAMSUNG ELECTRONICS CO LTD142 citations97
US5744827AApr 28, 1998
Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements
SAMSUNG ELECTRONICS CO LTD312 citations97
US6229205B1May 8, 2001
Semiconductor device package having twice-bent tie bar and small die pad
SAMSUNG ELECTRONICS CO LTD208 citations96
US6087722AJul 11, 2000
Multi-chip package
SAMSUNG ELECTRONICS CO LTD260 citations96
US5804874ASep 8, 1998
Stacked chip package device employing a plurality of lead on chip type semiconductor chips
SAMSUNG ELECTRONICS CO LTD146 citations96
US5894107AApr 13, 1999
Chip-size package (CSP) using a multi-layer laminated lead frame
SAMSUNG ELECTRONICS CO LTD47 citations91
US6319828B1Nov 20, 2001
Method for manufacturing a chip scale package having copper traces selectively plated with gold
SAMSUNG ELECTRONICS CO LTD18 citations83
US5811875ASep 22, 1998
Lead frames including extended tie-bars, and semiconductor chip packages using same
SAMSUNG ELECTRONICS CO LTD11 citations71