P

Inventor

TONG QUINN K

US16 patents
⚠️ This page may combine multiple inventors who share the name “TONG QUINN K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAT STARCH CHEM INVEST

15 patents
US6344157B1Feb 5, 2002

Conductive and resistive materials with electrical stability for use in electronics devices

NAT STARCH CHEM INVEST52 citations95
US6063828AMay 16, 2000

Underfill encapsulant compositions for use in electronic devices

NAT STARCH CHEM INVEST65 citations95
US6057381AMay 2, 2000

Method of making an electronic component using reworkable underfill encapsulants

NAT STARCH CHEM INVEST53 citations95
US6316566B1Nov 13, 2001

Package encapsulant compositions for use in electronic devices

NAT STARCH CHEM INVEST31 citations92
US6281314B1Aug 28, 2001

Compositions for use in the fabrication of circuit components and printed wire boards

NAT STARCH CHEM INVEST46 citations92
US5807959ASep 15, 1998

Flexible epoxy adhesives with low bleeding tendency

NAT STARCH CHEM INVEST41 citations92
US5770706AJun 23, 1998

Snap-cure epoxy adhesives

NAT STARCH CHEM INVEST28 citations92
US5620683AApr 15, 1997

Aqueous, acrylic hair fixatives and methods of making same

NAT STARCH CHEM INVEST21 citations92
US6833629B2Dec 21, 2004

Dual cure B-stageable underfill for wafer level

NAT STARCH CHEM INVEST24 citations89
US7037399B2May 2, 2006

Underfill encapsulant for wafer packaging and method for its application

NAT STARCH CHEM INVEST13 citations81
US6180187B1Jan 30, 2001

Method of making an electronic component using reworkable underfill encapsulants

NAT STARCH CHEM INVEST14 citations73
US5856383AJan 5, 1999

Snap-cure epoxy adhesives

NAT STARCH CHEM INVEST7 citations73
US7004375B2Feb 28, 2006

Pre-applied fluxing underfill composition having pressure sensitive adhesive properties

NAT STARCH CHEM INVEST9 citations71
US5854315ADec 29, 1998

Snap-cure epoxy adhesives

NAT STARCH CHEM INVEST2 citations62
US6350838B2Feb 26, 2002

Package encapsulant compositions for use in electronic devices

NAT STARCH CHEM INVEST1 citations51

HENKEL AG & CO KGAA

1 patent