Inventor
KISTLER RODNEY C
US24 patents
⚠️ This page may combine multiple inventors who share the name “KISTLER RODNEY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CABOT MICROELECTRONICS CORP
10 patentsUS6217416B1Apr 17, 2001
Chemical mechanical polishing slurry useful for copper/tantalum substrates
CABOT MICROELECTRONICS CORP202 citations99
US6126853AOct 3, 2000
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP116 citations99
US6593239B2Jul 15, 2003
Chemical mechanical polishing method useful for copper substrates
CABOT MICROELECTRONICS CORP56 citations96
US6432828B2Aug 13, 2002
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP58 citations96
US6620037B2Sep 16, 2003
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP80 citations95
US6447371B2Sep 10, 2002
Chemical mechanical polishing slurry useful for copper/tantalum substrates
CABOT MICROELECTRONICS CORP58 citations94
US6569350B2May 27, 2003
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP23 citations92
US6362106B1Mar 26, 2002
Chemical mechanical polishing method useful for copper substrates
CABOT MICROELECTRONICS CORP25 citations92
US6309560B1Oct 30, 2001
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP41 citations92
US7381648B2Jun 3, 2008
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP7 citations74
LAM RES CORP
4 patentsUS6769961B1Aug 3, 2004
Chemical mechanical planarization (CMP) apparatus
LAM RES CORP20 citations93
US6752693B1Jun 22, 2004
Afferent-based polishing media for chemical mechanical planarization
LAM RES CORP14 citations84
US6890245B1May 10, 2005
Byproduct control in linear chemical mechanical planarization system
LAM RES CORP9 citations74
US6875322B1Apr 5, 2005
Electrochemical assisted CMP
LAM RES CORP11 citations74
CABOT CORP
3 patentsUS6063306AMay 16, 2000
Chemical mechanical polishing slurry useful for copper/tantalum substrate
CABOT CORP372 citations99
US5954997ASep 21, 1999
Chemical mechanical polishing slurry useful for copper substrates
CABOT CORP480 citations99
US5858813AJan 12, 1999
Chemical mechanical polishing slurry for metal layers and films
CABOT CORP320 citations98
MICRON TECHNOLOGY INC
3 patentsUS7537511B2May 26, 2009
Embedded fiber acoustic sensor for CMP process endpoint
MICRON TECHNOLOGY INC9 citations84
US7628680B2Dec 8, 2009
Method and apparatus for removing material from microfeature workpieces
MICRON TECHNOLOGY INC3 citations61
US7294049B2Nov 13, 2007
Method and apparatus for removing material from microfeature workpieces
MICRON TECHNOLOGY INC3 citations61